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Important Dates

Conference:

May 29-31, 2018

Full Paper Due: Jan. 1, 2018

Abstract Due: Jan. 1, 2018

Audience Registration Due:
May 29, 2018

The 2nd Int'l Conference on Intelligent Transportation Engineering and Smart City (ITESC 2018) will be held during May 29-31, 2018 in Chengdu, China. ITESC 2018 is sponsored by Engineering Information Institute, Open Access Library, Scientific Research Publishing, and 1000thinktank. The conference will cover issues on Intelligent Transportation Engineering and Smart City. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods in related fields.

Chengdu located in southwest People's Republic of China, is the capital of Sichuan province and a sub-provincial city. Chengdu is also one of the most important economic centers, transportation and communication hubs in Southwestern China. According to the 2007 Public Appraisal for Best Chinese Cities for Investment, Chengdu was chosen as one of the top ten cities to invest in, out of a total of 280 urban centers.

More than four thousand years ago, the prehistorical Bronze Age culture of Jinsha established itself in this region. The fertile Chengdu Plain, on which Chengdu is located, is called Tianfuzhi guo in Chinese, which literally means "the country of heaven", or more often seen translated as "the Land of Abundance". It was recently named China's 4th-most livable city by China Daily.

Contact Us
Email: eng_sep@engii.org
Tel: +86 156 2908 5792
QQ: 3025797047
WeChat: Engii_hw 
For urgent issue, please contact Rolinrolin@126.com
Publication and Presentation

All the accepted papers will be published by "World Journal of Engineering and Technology" (ISSN:2331-4222), a peer-reviewed open access journal that can ensure the widest dissemination of your published work, For more information, please visit: http://www.scirp.org/journal/wjet/.

You're welcome to submit abstracts for presentation. The abstracts are only used for an oral presentation and will not be published in the conference journal.

Organizer & Sponsor
Engineering Information Institute
Scientific Research Publishing
1000Thinktank
Open Access Library