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Countdown
332 days

Important Dates

Conference:

Aug. 21-23, 2018

Full Paper Due: Dec. 22, 2017

Abstract Due: Dec. 22, 2017

Audience Registration Due:
Aug. 21, 2018

The 5th Conference on New Advances in Condensed Matter Physics (NACMP 2018) will be held from August 21 to 23, 2018 in Kunming, China. This Conference will cover issues on Condensed Matter Physics. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.

NACMP 2018 will be an important and reliable platform for inspiring international and interdisciplinary exchange at the forefront of physics. The Conference will bring together academicians, engineers, educators and policy-makers from all over the world, and we hope that you will take this opportunity to join us for academic exchange and visit the city of Kunming.

Kunming, Yunnan’s capital, resides at an elevation of 1890m and boasts a milder climate than most other Chinese cities. Celebrated as the "Spring City," Kunming has neither severe winters nor extremely hot summers and can be visited at any time of the year.

Contact Us
Email: phy_aug@engii.org
Tel : +86 156 2908 5792
QQ: 3025797047
Wechat(微信): Engii_hw
Speakers
Prof. Peng-Sheng Wei
Prof. Peng-Sheng Wei
National Sun Yat-Sen University, Chinese Taipei
Dr. Mrinal Pal
Dr. Mrinal Pal
CSIR-Central Glass and Ceramic Research Institute, India
Publication and Presentation

All the accepted papers will be published by Solid State Phenomena owned by TTP publishing in Switzerland and submitted to Ei Compendex databases for indexing. NO paper will be accepted since May 1, 2018 (Final Deadline). Abstract submission and simple attendance (without presentation) is still accepted. (pending)

You're welcome to submit abstracts for presentation. The abstracts are only used for an oral presentation and will not be published in the conference journal.

Organizer & Sponsor
Wuhan University
Nanjing Normal University
Engineering Information Institute
1000Thinktank
Open Access Library