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Template for Manuscripts

中文模版下载

Important Dates

Conference:

Mar. 23-25, 2018

Full Paper Due: Mar. 8, 2018

Abstract Due: Mar. 8, 2018

Audience Registration Due:
Mar. 23, 2018

Technical Program Committee

Technical Program Committee

Dr. Shankar Chelliah
Universiti Sains Malaysia, Malaysia
Prof. Ivica Veža
University of Split, Croatia
Prof. Loc Nguyen
International Engineering and Technology Institute, Vietnam
Dr. Sang-Bing Tsai
University of Electronic Science and Technology of China, China
Prof. Anil Kumar
Applied Sciences ( Mathematics) Echelon Institute of Technology, India
Prof. Sulaiman O. Olanrewaju
Universty Malaysia Terengganu, Malaysia
Prof. Hamid Yaghoubi
Iran Maglev Technology (IMT), Iran
Dr. MUDDASSAR SARFRAZ
Hohai University, China