二维码
联系我们 IMG_WeChat

btn_Registration

Countdown
228 days

Template for Manuscripts

Important Dates

Conference:

Jan. 5-7, 2019

Full Paper Due: Aug. 1, 2018

Abstract Due: Aug. 1, 2018

Audience Registration Due:
Jan. 5, 2019

The 5th Int’l Conference on Surface and Interface of Materials (SIM 2019) will be held in Bangkok, Thailand during January 5-7, 2019. SIM is an annual regular conference since 2015 and has been successfully held in Shanghai, China and Bangkok, Thailand. SIM 2019 will be a valuable and important platform for inspiring Int’l and interdisciplinary exchange at the forefront of Surface and Interface of Materials. 


The aim of SIM 2019 is to provide a stage for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Surface and Interface of Materials. We are looking forward to your participation!


Bangkok, the city once known as Siam, remarkably known to be exotic and rich in culture, is the cultural, economic and political capital of Thailand. The city features both old-world charm and modern convenience. Amidst the gleaming skyscrapers of Bangkok, one would still see traditional architectures such as temples, illustrating the retention of its identity whilst being a cosmopolitan city.

We look forward to seeing you in Bangkok during January 5-7, 2019!


Contact Us

Contact Person: Ms Vicky 
Email: material.jan@engii.org
Tel: +86 150 7134 3477
QQ: 3025797047
WeChat: Engii_Vivian 
For urgent issue, please contact ic_vicky@163.com


Publication and Presentation

All the accepted papers will be published by "Journal of Materials Science and Chemical Engineering" (ISSN: 2327-6045), a peer-reviewed open access journal that can ensure the widest dissemination of your published work, For more information, please visit: http://www.scirp.org/journal/msce/.

You're welcome to submit abstracts for presentation. The abstracts are only used for an oral presentation and will not be published in the conference journal.

Organizer & Sponsor
Engineering Information Institute
Scientific Research Publishing
1000Thinktank
Open Access Library